Statement from Microsoft Regarding Illegal Posting of Windows Source Code
Microsoft is sending letters explaining to individuals who have already downloaded the source code that such actions are in violation of the law.
AOL Announces New Lawsuit Against Spammers
AOL Ratchets Up Antispam Enforcement Efforts to Hold Spammers Accountable For Illegal Actions
LCD PC Monitors Outship Traditional CRTs by 2004, IDC Says
Flat-panel liquid crystal display (LCD) PC monitors are flooding the market and forcing the continued erosion of traditional cathode-ray tube (CRT) shipments.
Gateway Launches a Value Notebook
Gateway's Most Affordable Intel Centrino Notebook Boasts Advanced Mobility, Docking Capability and Extended Battery Life
Intel Outlines Platform Innovations for More Manageable, Balanced and Secure Enterprise Computing
In their keynotes today at the Intel Developer Forum, Intel Corporation executives Bill Siu and Mike Fister showed how a variety of Intel-based computers -- from clients to back-end servers -- enable enterprises to best handle the unique computing requirements for all-sized businesses.
SCO Announces OpenServer Update Pack 2
SCO Outlines Roadmap for the Next Release of SCO OpenServer and Subsequent Upgrades
Maxtor Demonstrates Single-Chip Native SATA Drives at IDF
Maxtor and Intel Team to Show the Performance of Native Command Queuing and the Flexibility of Hot Plug Capabilities Using Next Generation SATA Drives
ACCPAC Improves Simply Accounting Online
ACCPAC International, Inc. announced today the addition of a range of new business productivity features to its Simply Accounting Online hosted service for small businesses (www.simplyaccountingonline.com).
Sony Unveils Latest Videoconferencing System for SMBs
Sony of Canada Ltd. today introduced the PCS-11 videoconferencing system, designed specifically to meet the point-to-point conferencing needs of the small and medium- sized business market.
IBM Perfects New Method for Making Low Power, High Performance Processors
IBM today announced it has developed a new method of manufacturing low power, high performance microprocessors using an industry-first combination of silicon-on-insulator (SOI), strained silicon and copper wiring technologies.
